Silicone Free Heat Sink Compound

The compound fills the gap between the cpu central processing unit or other heat generating components. Free shipping on your first order shipped by amazon. Thermal paste also called thermal compound thermal grease thermal interface material tim thermal gel heat paste heat sink compound heat sink paste or cpu grease is a thermally conductive but usually electrically insulating chemical compound which is commonly used as an interface between heat sinks and heat sources such as high power semiconductor devices.

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Tech spray 1978 dp tech spray 1978 dp heat sink compound silicone free white paste. Temperature range from 45 degrees f to 500 degrees f. Fire fighting measures extinguishing media special remarks on fire hazards special remarks on explosion hazards promptly isolate the scene by removing all persons from the vicinity of the incident if there is a fire. 4 7 out of 5 stars 26.

Suitable for use in a variety of electrical applications including use with calrods thermistors and thermocouple wells. Temperature range from 40 degree c to 200 degree c. Color white paste. Silicone free heat sink compound use an extinguishing agent suitable for the surrounding fire.

Easycargo 20gr thermal paste kit conductive grease heatsink white silicone carbon compound for cooling heat sink interface cpu gpu vga led transistors 20gr 4 6 out of 5 stars 45 6 99 6. In addition heatsink paste is used with thermocouple wells thermistors and calrods or wherever efficient cooling is required. Super lube silicone heat sink 3 oz. 1446622 silicone heat sink compound lubricant grease 5 oz 140 g tube.

Arctic mx 4 4 grams thermal compound paste carbon based high performance heatsink paste thermal compound cpu for all coolers thermal interface material. Silicone free heat sink compound draws heat away when applied to a component. Also known as thermal grease thermal paste thermal compound cpu grease heat paste heat sink paste and thermal interface material. Excellent heat transfer efficiency.

Will not react to rubber or plastic. For electrical applications heat sink compound is used to thermally bond a component with a mechanical heat sink. With the ability to draw heat away when applied to a component this techspray silicone free heat sink compound is generally used to thermally bond a component with a mechanical heat sink. Silicone compound blended with thermally conductive fine metal oxide powders.

In electronics heat sink compound is generally used to thermally bond a component with a mechanical heat sink. Will not harden or melt.

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Silicone Free Heat Sink Compound